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Nasdaq Markets
Key PointsWood's bullish case for Bitcoin puts the cryptocurrency at $1.25 million in the next five years.
Nasdaq Markets
(RTTNews) - Meta Platforms Inc. (META) is asking some individual contributors in its Applied AI (AAI) division to return to management roles as part of a recent reorganization, according to people familiar with the matter.
Semiconductor Engineering
Researchers at National Yang Ming Chiao Tung University and TSMC published a technical paper titled “High contrast EUV imaging enabled by topological quasi phase-only masks.” Abstract Excerpt: “Here, we propose a paradigm shift in EUV PSM technology by introducing molybdenum (Mo)-based quasi phase-only masks (quasi-POMs) with high reflectivity and minimal absorption. Through rigorous electromagnetic simulations,... » read more The post Molybdenum Quasi Phase-Only Masks Improve EUV Imaging (NYCU, TSMC) appeared first on Semiconductor Engineering .
Nasdaq Markets
Key PointsApplied Materials is a leading provider of the equipment and software essential for manufacturing advanced semiconductors.
Nasdaq Markets
Key PointsOracle says GPU capacity that came up for renewal in fiscal Q1 was renewed or resold at a 20% premium to prior contracts.
Semiconductor Engineering
Researchers at imec, KU Leuven, and ASM published a technical paper titled “Dissecting the transition metal dichalcogenides-based metal-oxide-semiconductor structures charge components.” Abstract Excerpt: “Different variable charges such as interface traps, oxide border traps, and mobile carriers can contribute to the total capacitance in metal oxide semiconductor (MOS) field-effect devices. This study aims to quantify these... » read more The post Characterizing Charge Components In TMD-based MOS Structures (imec, KU Leuven, ASM) appeared first on Semiconductor Engineering .
Nasdaq Markets
Key PointsAlliance is catering to the premium collectible crowd.
Channel NewsAsia Business
On Friday, bets increased that the Fed will hike by a quarter percentage point after data showed consumer inflation picked up in August.
Nasdaq Markets
Hewlett Packard Enterprise (NYSE:HPE), an enterprise servers and networking provider, closed at $62.09, up 12.43%. Investors focused on its AI infrastructure positioning and stronger demand across AI systems, networking, and hybrid cloud.Trading volume reached 33.7 million shares
Semiconductor Engineering
Researchers at the NIST, UCSD et al. published a technical paper titled “Predicting Cure Evolution and Thermal Endurance of a Highly Filled Epoxy Underfill for Advanced Packaging.” Abstract Excerpt: “Epoxy underfill materials are critical to advanced semiconductor packaging by enhancing mechanical integrity, redistributing thermomechanical stresses, and improving solder-joint reliability in flip-chip and other fine-pitch interconnect... » read more The post Modeling Predicts Cure And Thermal Endurance Of Advanced Packaging Underfill (NIST, UCSD et al.) appeared first on Semiconductor Engineering .